Electronics Packaging Technology and New Energy Technology

A New Technology for Terahertz Electronics

Modern Electronic Packaging Technology

A view of modern electronic packaging technology is presented along with its applications at APL. Although not always distinct, electronic packaging may be separated into three levels: component, board, and system. The manufacturing technologies and designs may vary at each level, but they all must provide electrical interconnection, thermal management, and mechanical and environmental protecti...

Semiconductor Packaging Assembly Technology

This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board (PCB). Another function is to provide the desired mechanical and environmental protection to ensure reliability and performance. Three fundamental assembly flow processes ...

Electronics Technology at APL

PL programs have made signifi cant and continuous use of electronics technology from the very beginning. In fact, the VT fuze was a marvel of the Laboratory’s electronics technology and the ingenuity of its practitioners. Electronics technology at APL can be subdivided into fi ve broad areas: microelectronics and advanced packaging, RF and microwaves, embedded computers and programmable devices...

Acs New Energy Technology Symposium

T he fifth New Energy Technology Symposium was held at the 241st American Chemical Society (ACS) meeting at the Sheraton Park Resort in Anaheim, California on March 27 and 28. The organizer of the symposium, Dr. Jan Marwan of Dr. Marwan Chemie, was unable to chair the meeting due to personal reasons. However, the sessions of the symposium were co-chaired by Dr. Francis Tanzella of SRI Internati...